| Offerings |
- Up to 44 layers
- ATE boards: load, burn-in, DUT, probe, mother board systems, daughter boards
- 30" x 30" maximum panel size
- Rigid, rigid flex, flex boards (Kapton, PET, PEN materials)
- RoHS, ISO, UL, Class 3, Medical, Military compliant
- Asia capabilities for above offerings (except medical & military)
|
| Lead Times |
Prototype PCB Fabrication
- 1 to 5 days - US
- up to 14 layers in 24 hours
- 5 to 20 days - Asia
- 10 days - BEST VALUE
Production PCB Fabrication
- 2 weeks - FA samples to support production orders
- 4-5 weeks - flex, rigid flex, rigid designs
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| Plating |
- HAL (lead free)
- Immersion tin, silver, gold
- Hard & soft gold, up to 180 uin
- OSP
- Selective plating
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|
| Material |
- Hi temp FR4
- Polyimide
- Rogers 4000 series
- Getek
- Nelco
- Others upon request
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|
Lamination
|
- Board thickness - .005" to .250"
- Min core thickness - .002"
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|
Drilling
|
- .002" min laser drill through hole
- 15:1 aspect ratio
- Depth controlled
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Soldermask
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- LPI (multi colors)
- Dry film
- Wet mask
- Carbon Ink (w/ tolerances)
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|
Testing
|
- Flying probe, fixtureless
- Flying grid
- Full Net List
- Polar for controlled impedance
- Double sided test, 10-100 volt
- Continuity resistance, 10-30 ohms
- Isolation resistance, 2.5 to 10.0 MegOhms
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| Capabilities Roadmap |
|
| Board Features |
Standard |
Premium |
Advanced |
Emerging |
Comments |
| Laser Drilling/ Routing - w/vision |
Available |
Available |
Available |
Available |
 |
| Lines and Spaces (Outer) |
.005" |
.004"-.003" |
.002" |
.0025" |
|
| Lines and Spaces (Inner) |
.005" |
.004"-.003" |
.002" |
.0025" |
|
| Outer Annual Ring |
.007" |
.006"-.003" |
<.003" |
.0000000000" |
|
| Inner Annual Ring |
.007" |
.006"-.003" |
<.003" |
.000"/build-up |
|
| Hole to Plane Clearance or Conductor |
0.013 |
.012-.007 |
.006-.0045 |
|
|
| Layer to Layer Registration (Core to Core) |
.005" |
.004"-.003" |
.002" |
|
Material Dependent |
| Layer to Layer Registration (Top to Bottom) |
.005" |
.004"-.003" |
.002" |
|
|
| PCB Thickness Tolerance |
10% |
9 - 5% |
.002" |
|
|
| Mechanical Drill Hole Minimum |
.016" |
.0145"-.006" |
0.0059 |
|
|
| Laser Drilled Holes |
.006" |
.005"-.002" |
.001" |
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|
| Aspect Ratio (=/> than .015") |
9:1 |
10:1 - 16:1 |
17:1 - 20:1 |
21:1 - 25:1 |
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| Controlled Impedance Characteristic |
10% |
9 - 5% |
3% |
1 Ohm |
|
| Differential |
10% |
9 - 5% |
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|
|
| Fabrication Radius |
+/-5 degrees |
+/-5 degrees |
+/-5 degrees |
+/-5 degrees |
|
| Warpage: flatness of finished board (inch per inch) |
0.010 |
0.008 |
0.005 |
0.003 |
|
| Min Dielectric Thickness |
0.004 |
0.004 |
0.002 |
0.001 |
|
| LPI Soldermask (Dams) |
.005" |
.004" - .003" |
.002" |
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|
| Layer Count |
20 |
>30 |
>40 |
>50 |
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| Panel Sizes |
12 X 18 |
18 x 24 |
20 x 26 |
22 x 30 |
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| Max Board Thickness |
0.125 |
0.200 |
0.300 |
<0.300 |
|
| Min Board Thickness |
0.062 |
0.008 |
0.006 |
0.002 |
|
| Min Board Thickness Tolerance |
+/- 10% |
+/-7.5% |
+/-5% |
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|
|
| Pad to Hole Size |
Standard |
Premium |
Advanced |
Emerging |
|
| Min Plated Hole Size |
0.010 |
0.010 |
0.006 |
0.002 |
|
| Tolerance- Plated Hole Size |
+/-0.003 |
+/-0.003 |
+/-0.002 |
+/-0.001 |
|
| Min Inner Layer Pad (1 mil annular ring) |
+/-0.018 |
+/-0.018 |
+/-0.012 |
+/-0.008 |
|
|
over FHS |
over FHS |
over FHS |
over FHS |
|
| Mech Min Drill Hole Size |
0.010 |
0.010 |
0.006 |
0.004 |
|
| Laser Min Drill Hole Size |
0.006 |
0.004 |
0.002 |
|
|
| Normal Finished Hole Sizes |
0.010 |
0.008 |
0.006 |
0.004 |
|
| Plane Relief Diameter Over Drilled Hole |
0.024 |
0.02 |
0.016 |
0.01 |
|
| Min Outer Layer Pad (1 mil annular ring) |
0.012 |
0.010 |
0.008 |
0.006 |
|
|
over FHS |
over FHS |
over FHS |
over FHS |
|
| Min Outer Non Plated Hole to Metal |
0.010 |
0.010 |
0.008 |
0.008 |
|
| Min Inner Non Plated Hole to Metal |
0.010 |
0.010 |
0.008 |
0.008 |
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| Max Number Holes per Square In (average over board) |
200 |
200 |
300 |
1,000 |
|
| Max Number Holes per Square In (localized density) |
n/a |
n/a |
n/a |
n/a |
|
|
| Testing Capabilities |
| Universal Grid Tester (UGT) |
| Flying Probe Tester: |
| Min Pitch - 0.005 |
| Min Feature Size - 0.002 |
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| Soldermask Criteria |
Standard |
Advanced |
Premium |
Emerging |
|
| SMT Min Pad Spacing |
0.008 |
0.008 |
0.007 |
0.007 |
|
| Line to SMT Min Space |
0.005 |
0.004 |
0.003 |
0.003 |
|
| Min Soldermask Rib |
0.005 |
0.005 |
0.004 |
0.003 |
|
|
| Materials |
| FR4 (Di, Multi, Tetra-fuctional) |
| High Temp FR4 (Di, Multi, Tetra-fuctional) |
| G200 |
| G-tech |
| Polyimide |
| Resin Coated Foil |
| Thermount (Polyimide) |
| Thermount (Epoxy) |
| BT |
| Glass Reinforced Ceramic |
| PTFE Woven (D/S & Hybrid MLB) |
| PTFE Non-Woven (D/S & Hybrid MLB) |
| PTFE Ceramic (D/S & Hybrid MLB) |
| Speed Board C Prepreg |
| Speed Board N Prepreg |
| Full Array of Bonding Films |
| Flex (Capton-Upilex/LPI Covercoats) |
|
| Material Processing |
| Omega Ply Buried Resistors |
| Copper Invar Copper Metal Cors |
| Heat Sinks (Brass, Copper, & Aluminum) |
| Hole Filled (Plated over) |
| CB100 Silver Fill |
| SD2361 Epoxy Fill |
|
| Surface Finishes |
Standard |
Advanced |
Premium |
Emerging |
|
| Hot Air Solder Level (HASL) Min thickness |
0.0003 |
0.0003 |
0.0002 |
|
|
| HASL Max thickness |
0.0015 |
0.0015 |
0.001 |
|
|
| HASL Co Plan |
+/- 1000 uin |
+/- 1000 uin |
+/- 500 uin |
|
|
| OSP |
| Immersion Gold Thickness |
3-5 uin |
5-8 uin |
|
|
|
| Immersion Silver Thickness |
10-20 uin |
10-20 uin |
10-20 uin |
|
|
| Immersion Tin |
30-50 uin |
30-50 uin |
|
|
|
| Electrolytic Hard Gold (Knoop Hardness 120 or >) |
50 uin |
|
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|
|
| Soft Electrolytic Gold (Knoop Hardness 90 or <) |
| Electrolytic Nickel |
| Electroless Nickel |
| Carbon Coating |
