About Circuit Pro Solutions
Capabilities

Electrical Engineering Capabilities

Electrical Systems

  • Digital Systems
  • Analog Systems
  • Mixed Analog/Digital
  • A/D & D/A Low EMI
  • AC/DC and DC/DC

Networking

  • 1G and 10G Ethernet and IP Networking
  • Fiber Optics
  • Telecom Systems

Embedded Systems

  • 8-16-32-64 Bit
  • RISC/DSP Architecture
  • Microprocessor-Based
  • Microcontroller-Based

Radio Frequency (RF) Systems

  • Wireless Systems
  • Bluetooth/ZigBee-Enabled Devices
  • WiFi (802.11x) Systems
  • GPS
  • RFID
  • Wireless Command and Control Systems
  • Mesh Networks
  • Cellular

Communication Interfaces

  • USB
  • Serial-Port
  • ISA Bus
  • PCI Bus
  • CAN Bus
  • I2C
  • RS232/RS485

Logic Design

  • Field Programmable Gate Array (FPGA) Design
    • Altera FPGAs
    • Xilinx FPGAs
  • Programmable Logic Device (PLD) Design
    • Verilog/VHDL/Abel
  • Complex Programmable Logic Device (CPLD) Design

Electrical Prototyping

  • Breadboard and Proof of Concept
  • Designs
  • Electronics System Prototypes

Battery and Power Systems

  • Low and Ultra-Low Power Consumption Designs
  • Power Management
  • Power Optimized Designs
  • AC/DC Power Systems
  • Battery Charging/Recharging Circuit Designs

Design Model

Full Design Responsibility:

  • Schematic Capture
  • Layout
  • Signal Integrity (SI) Simulation
  • Power Integrity (PI) Simulation
  • 3-D Mechanical Design
  • Thermal Simulation

PCB Layout Capability

  • Schematic capture
  • FPGA Development
  • High Speed Digital, Analog, Mixed & RF designs
  • High Layer count boards: 36+ layers
  • High-speed serial 1GHz to 10GHz circuits
  • High-speed parallel circuits, e.g. DDR2/3/4, RLDRAM, QDR memory interfaces
  • Mixed-signal boards requiring noise / power isolation
  • Signal Integrity: pre- and post-layout analysis and verification
  • Impedance-controlled, transducer-interfacing, and sensitive signal designs
  • RoHS/WEEE compliant lead-free designs
  • Create PCB stack-ups to improve EMI/FCC issues
  • High Density PCBs (> 500 pins/sq. in)
  • Fine Pitch BGA, High Pin Count BGA
  • Flexible PCB & Rigid-Flex PCB
  • High Speed Serial backplanes
  • High Speed interconnects:
    • PCI, PCIX, PCIe, SAS, SATA, XAUI, XFP, SFP+, QSFP, SerDes, QPI, …
  • DDR2, DDR3, DDR4 memory designs
  • 100% Manual Routing – No auto-route allowed
  • Design for Testability (DFT) & Manufacturability (DFM)
  • Expertise in eCAD Cadence & Mentor Graphics tools – Allegro & PADs
  • Provide 100% Electrically constrained PCB in Allegro
  • Design review for DFM/DFT
  • Integration of electrical, mechanical, software
  • Design of an existing schematic for components modification or replacement
  • Full PCB Library Management
  • End-of-Life and cost-reduction redesigns